Kepital F25-03H LOF
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A medium-low viscosity grade for general injection molding with high-stiffness.
It has improved on thermal stability. Low odor grade improved on heat stability.
| Properties | Test condition | Method | Unit | Value | |
|---|---|---|---|---|---|
| Physical | Density | ISO 1183 | g/cm³ | 1,41 | |
| Physical | Melt Flow Rate | ISO 1133 | g/10min | 13 | |
| Physical | Molding Shrinkage (Flow Direction) | t 3mm, Ø 100mm | KEP Method | % | 2 |
| Thermal | Heat Deflection Temperature (HDT) | 1.8 MPa | ISO 75-1,2 | ˚C | 101 |
| Thermal | Flammability | UL94 | Class | HB | |
| Mechanical | Tensile Strength | 23˚C | ISO 527-1,2 | MPa | 68 |
| Mechanical | Flexural Strength | 23˚C | ISO 178 | MPa | 94 |
| Mechanical | Flexural Modulus | 23˚C | ISO 178 | MPa | 2.800 |
| Mechanical | Charpy Notched Impact Strength | ISO 179/1eA | kJ/m² | 6,5 | |
| Mechanical | Nominal Strain at Break | 23˚C | ISO 527-1,2 | % | 32 |
| Mechanical | Tensile Modulus | 23˚C | ISO 527-1,2 | MPa | 2.900 |
| Electrical | Surface Resistivity | IEC 60093 | Ω | 1 x 10^16 | |
| Electrical | Volume Resistivity | IEC 60093 | Ω • cm | 1 x 10^14 | |
| Electrical | Dielectric Strength | IEC 60243-1 | kV /mm | 19 |